Insight Global is looking for a Metrology Development Engineer II with a key focus in mechanical characterization to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices, including thermal management, etc. The selected candidate will work as part of a close-knit team in establishing the measurement and characterization infrastructure at this organization. They must be well-versed in all aspects of mechanical metrologies spanning fundamental theory and design to practical application of novel measurement methods. Essential to the role is collaboration with engineers and technicians across the organization to anticipate and address their design and development needs, assist in process and tool optimization, and participate in industry standardization efforts. The ideal candidate will be an excellent team player and serve as a critical member of the product development engineering team.
Responsibilities:
Lead the selection, procurement, installation and qualification of metrology equipment and systems with a focus on advanced package mechanical characterization.
Develop a specific metrology tool set that effectively measures mechanical performance metrics for 3DHI systems.
Provides vision and direction in developing forward-looking measurement technologies and establish a robust metrology roadmap.
We are a company committed to creating inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity employer that believes everyone matters. Qualified candidates will receive consideration for employment opportunities without regard to race, religion, sex, age, marital status, national origin, sexual orientation, citizenship status, disability, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to
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PhD in Mechanical Engineering and MS in Mechanical Engineering with 5 years of experience in developing mechanical measurement techniques (examples include warpage and CTE measurement techniques)
BS with minimum 8 years of experience working in Mechanical R&D roles with prior experience in metrology labs and semiconductor industry will also be considered.
Mission oriented approach with ability to manage multiple projects simultaneously.
Excellent written and verbal communication skills.
Demonstrated ability to work successfully in a collaborative team environment.
Experience writing and working with project level requirements and specifications.
Excellent analytical and problem-solving skills, as well as attention to detail.
Experience in a startup or research and development (R&D) environment.
Prior experience in semiconductor design, characterization, and/ or process integration.
Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, wafer-level packaging, and 3DHI a plus.
Prior experience in software development for hardware control and instrumentation.
Experience leading teams, working with contractors and managing people.
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.