Our client is seeking a highly motivated Member of Technical Staff in process engineering to become a part of our 300mm wafer fabrication facility in Malta, New York. The individual will be responsible for process sustenance and development that includes process variability reduction, recipe development, defectivity reduction and process optimization for high volume manufacturing (HVM). Collaborate with our clients internal customers and participate in development/manufacturing of unit process for various technologies including FinFET, Si Photonics and many more. Drive continuous improvement efforts in support of throughput improvement, cost reduction, and yield learning. Interact and collaborate closely with multiple internal and external stakeholders and teams such as equipment suppliers, equipment engineers and technicians, CFM (contamination free manufacturing) team, PI (process integration) team, cost management and quality assurance teams.
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Masters or PhD degree in Materials Science, Electrical Engineering, Solid State Physics, Chemical or other relevant engineering physical science discipline is preferred
Experience at Intel, TSMC, Micron, or SAS
Experience and understanding of high-volume manufacturing
Understanding of FEOL and BEOL integration
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.