We are seeking a seasoned BOD Engineer with deep experience in semiconductor tool integration and facilities design. This engineer will partner closely with Electrical Engineering (EE) Tool Owners to walk tools onsite, assess demolition and upgrade requirements, and help define how existing infrastructure will be replaced or modified.
This role is critical to the creation of Facilities Data Sheets (FDS) and involves validating point-of-use (POU) utility connections, ensuring line length distances meet spec, and confirming proper sizing for regulators and flow/pressure parameters. The engineer will interpret and adapt supplier design documentation to meet site-specific configuration needs, using 2D design tools.
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10+ years of experience in semiconductor facility or tool install engineering
Strong design background with direct tool walkdown experience
Ability to work with EE Tool Owners to define demo and upgrade scopes
Experience reviewing and verifying POU utilities and line length specs before FDS creation
Proficiency in validating flow rates, pressure drops, and regulator sizing
Skilled in interpreting supplier documentation and translating it to site-specific requirements
Proficient with 2D design tools used to generate Facilities Data Sheets (FDS)
Experience in high-volume manufacturing or fab environments
Familiarity with semiconductor facility systems and tool hook-up processes
Understanding of construction coordination and tool install timelines
Knowledge of AutoCAD or similar 2D CAD software
Experience working with cross-functional teams (Facilities, EHS, Tool Install, etc.)
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.