Our Client is seeking an experienced professional to support the 300mm semiconductor process integration team. The core responsibilities of this team involve ownership of process integration from development, customer engagement to production. The ideal candidate should have a proven track record of developing and delivering advanced technology for mass production. Also, the ideal candidate can demonstrate a technical understanding of various processes and an understanding of a balanced scorecard approach to develop, sustain, and improve the technologies with quality, cost, and delivery all considered. Feature rich process development in various technologies including FINFET technologies, FDSOI, eNVM, HV, Photonics and RF. Collaborating with process module & packaging team in driving process solutions. Working with Technology Development & Business Unit to oversee the scope of projects and ensure that all technical needs are catered to.
We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to
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* Master's Degree - must be in Electrical Engineering, Materials Science, Solid State Physics, or other relevant engineering physical science discipline
* 8+ years of working experience in Semiconductor industry
* 5+ years of Process/Product Integration Engineer experience
* Lead Engineer experience - developing and delivering advanced technology for mass production
* 6 months+ experience with RF Technologies
* Experience in the FEOL/BEOL process with FINFET technologies, FDSOI, eNVM, HV, or Photonics technologies
* PhD with 9+ years of working experience in relevant field
* Degree must be in Electrical Engineering, Materials Science, Solid State Physics, or other relevant engineering physical science discipline
* Ability to work effectively and efficiently with diverse teams, clients, as well as internal and external partners
* Strong presentation and technical writing skills
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.