Job Description
Work with various engineering disciplines on the development of spacecraft electronics packaging and interconnect system including wire harnesses, high speed connections, FPCs and PCBs.
End to end ownership of electronics packaging design including 3D design, drawing creation, prototyping, and manufacturing support.
Design for thermal management and support thermal analysis.
Interface with mechanical, thermal, and systems engineering on ICD design, testing, and assembly.
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Required Skills & Experience
Bachelor of Science degree in Mechanical Engineering, Electrical Engineering, or similar.
10+ years of experience in electro-mechanical engineering.
Skilled with CAD and harness design tools.
Experience with rigid and flex PCB technologies, packaging, and interconnect.
Experience with module packaging including integrating PCBs and wire harnesses into enclosures.
Familiarity with harness design best practices including applicable IPC standards.
Experienced with production level DFx and FMEA.
Demonstrated success working in a dynamic environment.
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.