Head of Program Management

Insight Global is seeking a Head of Program Management to sit onsite at a semiconductor client in Santa Clara, CA. This person will lead ASIC and platform development from architecture to production, coordinate cross-functional teams and vendors. They will manage timelines, budgets, and risks to ensure on-time delivery, drive technical reviews, strategic decisions, and process improvements while maintaining documentation and providing regular updates to stakeholders.
(This role can pay $250,000 - $280,000 a year based off years of experience).

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

•Bachelor’s or Master’s degree in Electrical or Computer Engineering, or a related field.
•15+ years of experience in semiconductor program management, with a strong background in ASIC development.
•Proven ability to lead and drive large-scale, complex semiconductor projects across multiple disciplines.
•Experience in working with external IP vendors and customers on deliverables and integration requirements.
•Strong understanding of the entire silicon development lifecycle, including front-end and back-end design, packaging, PCB design, and bring-up.
•Excellent problem-solving, leadership, and decision-making skills.
•Strong verbal and written communication skills, with the ability to interface with both technical and non-technical stakeholders.
•Experience with project management tools (e.g., Jira, MS Project, Confluence) and methodologies (Agile, Waterfall).
•Experience with networking ASICs, mixed-signal PHY SOCs, high-performance computing, AI/ML accelerators preferred
•Knowledge of firmware and software development in relation to silicon bring-up.

•PMP or similar program management certification

Benefit packages for this role will start on the 1st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.