· Run existing automated die attach and/or wire bond processes in a production setting
· Ability to perform manual and automated component attach assembly of microelectronic devices.
· Operate automated adhesive dispense and die attach equipment as trained by Company engineering/production leads
· Operate automated wire bond and wedge bond equipment as trained by Company engineering/production leads
· Support automated die attach and wire bond processes as needed to maintain product flow (will be trained on-site) for customer deliverable materials
· Provide feedback for process improvements
Participate in laboratory maintenance and upkeep efforts
PR: $25-$35
We are a company committed to creating inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity employer that believes everyone matters. Qualified candidates will receive consideration for employment opportunities without regard to race, religion, sex, age, marital status, national origin, sexual orientation, citizenship status, disability, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to
Human Resources Request Form. The EEOC "Know Your Rights" Poster is available
here.
To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy:
https://insightglobal.com/workforce-privacy-policy/ .
· Process background in microelectronic packaging specifically in die attach and/or wire bonding
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.