Senior or Principal Technical Program Manager

Insight Global is looking for a Senior or Principal Technical Program Manager that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. This will be the day-to-day execution and sponsor interface for a large, complex, government-funded program with high visibility and rigorous reporting and tracking responsibilities.

This role leads complex multi-disciplinary initiatives that drive innovation in microsystems technology. By orchestrating collaboration across internal teams and external partners, it ensures strategic alignment, timely execution, and clear communication of progress. The position also plays a key role in shaping program direction through industry insight and proactive problem-solving.

Responsibilities
Lead the planning, execution, and delivery of cross-disciplinary programs supporting advanced microsystems roadmap.
Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.
Coordinate efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives.
Serve as the central liaison between their internal technical teams, university researchers, and external stakeholders—including DoD partners, national labs, and commercial collaborators.
Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.
Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment.
Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.
Monitor industry trends in advanced packaging, 3DHI, and chiplet-based architectures, informing program direction and partnership strategy.
Other related functions as assigned.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques
Direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones.
Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.

Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.
Prior experience at a leading semiconductor foundry or packaging house

Benefit packages for this role will start on the 1st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.