Principal Signal & Power Integrity Engineer

Insight Global is looking for a Principal Signal & Power Integrity Engineer that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

This role is to lead and execute comprehensive Signal Integrity (SI), Power Integrity (PI), and Multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Responsibilities
Own and execute hands-on SI/PI and Multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
Run end-to-end simulation workflows including EM extraction, S-parameter generation, PDN impedance analysis, crosstalk/eye diagram simulations, thermal/structural reliability checks, and co-simulation across domains.
Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
Other related functions as assigned.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

12 or more years of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms. For both titles:
Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
Proven ability to extract/package-level models (RLC, S-parameters, dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
Demonstrated experience creating and validating PDK/ADK simulation collateral spanning SI/PI, RF, thermal, and mechanical domains.
Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.

Benefit packages for this role will start on the 1st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.