Principal Digital Architect

Insight Global is looking for a Principal Digital Architect that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Responsibilities:
· Architect next-generation digital subsystems and compute fabrics for 2.5D/3D microsystems—enabling scalable, high-bandwidth integration across AI, HPC, and wireless acceleration platforms.
· Define and optimize architecture specifications, dataflows, and interconnect topologies (chiplet fabrics, NoCs, HBM, PCIe/CXL) across heterogeneous dies.
· Collaborate with EDA, packaging, and system modeling teams to co-optimize digital architectures for performance, power, and reliability.
· Lead system-level modeling and design-space exploration for AI and signal-processing workloads using simulation and prototyping frameworks.
· Engage with industry partners and standards bodies (UALink, NVLink Fusion, UltraEthernet, CXL 3.x) to shape ecosystem directions.
· Mentor internal design teams on RTL methodologies, IP integration, and verification best practices for multi-die systems.
· Translate architectural innovations into roadmaps and reference designs, driving alignment between research, productization, and customer enablement.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

· Ph.D. or M.S. in Electrical or Computer Engineering (or equivalent practical experience).
· 12+ years of experience in digital or system architecture for SoC/FPGA/ASIC designs, with strong exposure to AI, networking, or HPC accelerators.
· Deep expertise in dataflow architectures, memory hierarchies, interconnects, and compute optimization.
· Hands-on experience with RTL design/verification (SystemVerilog/VHDL), hardware-software co-design, and FPGA prototyping.
· Proficiency in performance modeling and architectural trade-off analysis (SystemC, C++, or Python-based frameworks).
· Proven record of delivering complex digital design programs from concept through execution.

· Prior architecture experience at AI or semiconductor compute companies.
· Familiarity with heterogeneous (multi-materials and/or multi-function) compute integration and multi-die packaging (2.5D/3D, hybrid bonding, interposers).
· Experience with AI/ML or 5G/6G hardware acceleration, linear algebra, and signal-processing architectures.
· Knowledge of interconnect and chiplet standards (BoW, UCIe, CXL, NVLink, UALink) and their ecosystem enablement.
· Track record of publications, patents, or industry leadership in digital or system architecture.
· Excellent technical writing and presentation skills for cross-functional and customer-facing collaboration.

Benefit packages for this role will start on the 1st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.