Senior Manager/ Director, EDA Product Management

Insight Global is looking for a Senior Manager/ Director, EDA Product Management that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Responsibilities:
Define and own the EDA implementation and roadmap for multi-component and chiplet integration
platforms—spanning design kits, simulation tools, and reference flows from concept to deployment.
Lead the technical development of comprehensive PDKs and ADKs, including modeling, verification, and
enablement collateral to accelerate customer adoption of their technologies.
Act as a hands-on technical authority for EDA packaging workflows, bridging electrical, thermal, and mechanical
simulation domains.
Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA
vendors (Synopsys, Cadence, Ansys, Siemens) to ensure design enablement flows are aligned, validated, and
continuously improved.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced
packaging workflows.
Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous
integration.
Built and deployed PDKs/ADKs and understand the nuances of modeling, simulation, and qualification
across electrical, RF, mechanical, and thermal domains.
e end-to-end ownership of programs involving multiple
customer or partner stakeholders.
BS or MS in Electrical Engineering, Computer Engineering, or related discipline. Advanced degrees are a plus

Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.