An Insight Global client in Tucson, AZ is seeking a packaging engineer who comes from a process engineering background to join their team. This person will be responsible for process improvements to the company's wire/die bonding, oven vacuum and pick and place machine manufacturing process. The team currently has the front end of the process automated, but the backend is not currently automated - therefore a background and experience in setting up automated systems is critical as the team explores further automation. This person much have a strong experience in Lean Six Sigma principles, root cause analysis, continuous improvement and process SPC. This role does require the employee to be in-person in Tucson, AZ, but there is some day to day schedule flexibility as long as the job is getting completed. This role can pay between $100k and $130k and relocation assistance can be offered on a case by case basis. Exact compensation may vary based on education and experience.
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- Bachelor's or Master's Degree in Mechanical Engineering or related
- At least 3 years of experience with process engineering in the semiconductor industry assembling and improving laser equipment - specifically die bonding, wire bonding, and vacuum ovens.
- Strong SPC capabilities and analysis skills to excel in continuous improvement.
- Experience with process engineering around pick and place machines.
- Knowledge of Lean Six Sigma principles.
Experience with CAD software - Draftsight preferred
Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.